MEMS Testing & Characterisation – Femtotools Switzerland

MEMS Probe Station:

The FT-MPS02 MEMS Probestation is a wafer-level MEMS testing instrument that allows for the fast, user-friendly and simultaneous testing of mechanical, electrical and geometrical properties on MEMS chips.

Specifications:

Micromechanical Testing Module Specifications:

  • Fast, point-and-shoot measurements
  • Low-drift force measurement from 5 nN to 100 mN
  • Displacement sensing range 15mm x 10mm x 60mm
  • Hardware-level sensor protection mode
  • Can measure in horizontal and vertical direction
  • Axial force application (no tip-slippage)
  • Rotatable sensor mount for in-plane and out-of-plane sensing
  • Module is fully retractable when system is not in use

Dual Microscope Specifications:

  • Observation angle 0° (topview) and 50° (sideview)
  • Two 3MP CMOS digital cameras (2048 x 1536 pixels)
  • Motorized 1:7 optical zoom (topview camera)
  • Three LED illumination modes (coaxial, sidelight, backlight)

Probe Station, Electrical Sources and Meters Specifications:

  • 200mm (8 inch) wafer chuck with 150mm travel range and 360° rotation
  • Sample fixation by vacuum or mechanical clamps
  • 2 platforms for electrical probes, 15mm vertical travel range
  • Electrical probe fixation by vacuum or magnetic force
  • Voltage output (0-300V), current output (+-50mA)
  • Multimeter (+-400V, +-50mA)

Applications and capabilities

  • MEMS sensor and actuator testing and calibration
  • Mechanical testing (in-plane / out-of-plane)
  • Electrical testing
  • Etch-depth, over- and under-etch measurement
  • Release and stiction detection, fabrication yield measurement

  • Microelectronical Testing System System

    FT-MTA03 Micromechanical Testing And Assembly System: Micromechanical Testing and Assembly System is a highly versatile testing instrument for the accurate quantification of mechanical properties and dimensions/geometry in the micro- and Nano scale

    Specifications:

    Mechanical Testing Module Specifications:

    • Compression/tensile force sensing range: +-200 mN
    • Compression/tensile force sensing resolution: +-0.5nN @ 10Hz
    • 3-axis displacement/topography sensing (coarse): 20nm to 29 mm
    • 3-axis displacement/topography sensing (fine): 0.1nm to 50 um
    • Can measure in multiple directions (horizontal, vertical, angles)
    • Automated control by a PC and manual steering by joysticks
    • Can handle sub-millimeter objects from 0.01 mm to 0.1 mm

    Microscope Specifications:

    • Microscope tilting angle: -90° to +90°
    • Working range: 95mm
    • USB microscope camera: 2048 x 1536 pixel CMOS
    • Motorized optical zoom range: 1:7
    • Motorized focus range: 30mm
    • Motorized 2-axis sample stage range: 20mm x 20mm
    • LED illumination modes: coaxial through-the-lens, ring ligt, diffuse backlight

    Software Capabilities:

    • User-friendly graphical user interfaces (GUIs) for MS Windows
    • Force-contolled and deflection-controlled nanoindentation
    • Cyclic testing and dynamic mechanical analysis (DMA)
    • 2d and 3d topography mapping
    • Visualization, recording and exporting of measurement data
    • Software library for creating customized testing principles and sequences
    • Typical Applications:
      • Nano indentation
      • Micro Tensile Testing
      • Stylus Profilometry
      • Microstructure Analysis

    Nanomechanical Testing System

    The FT-NMT03 Nano mechanical Testing System:

    Nano robotic system for the direct and accurate, in-situ SEM/FIB measurement of the mechanical properties of nanostructures. Testing principles such as compression, tensile, cyclic or fracture tests are enabled by applying a load with a micro force sensor onto the nanostructures while using position encoders to measure their deformation

    Specifications:

    Force Sensing
    –  Maximum force: 200 mN
    –  Force resolution: 0.5 nN (at 10 Hz)
    –  Measurement frequency up to 96 kHz

    Displacement Sensing (coarse)
    –  Displacement range: 21 mm
    –  Displacement resolution: 1 nm (at 10 Hz)
    –  Measurement frequency: 50 Hz

    Displacement Sensing (fine)
    –  Displacement range: 25 μm
    –  Displacement resolution: 0.05 nm (at 10 Hz)
    –  Measurement frequency up to 96 kHz

    5-axis force sensor to sample alignment
    –  X, Y, Z closed-loop positioning range: 21mm x 12mm x 12 mm
    –  X, Y, Z closed-loop positioning resolution: 1 nm
    –  Sample Stage Tilt range: 90°
    –  Sample Stage Yaw range: 360°
    –  Sample Stage angular resolution: 35 micro-deg

    Applications and Capabilities

    • Micro pillar/Nano pillar Compression Tests
    • Nanofiber Tensile Testing
    • Testing of Capsules, Particles or Cantilevers
    • Electro-Mechanical MEMS/NEMS Testing
    • Micro handling and Micro assembly.

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