Solder Bar
Solder Bar formulated with High Virgin Raw Metals Processed in state-of-the-art Vaccualloy Technology that brings world class Quality along. Here, Oxygen interaction with Alloy is Nil and thus, Dross formulation is reduced at PCB Assembly Process. Also an increase flow rate & reduced impurities found. Bar Alloy is compatible for a typical range of Flux Application Formulas used in Electronics Industry Today.
Solder Flux
No Clean Flux, 5LTR, 10LTR, 20 LTR +
Solder Paste
- High print speed (0-120 mm/sec)
- Excellent wettability
- Reflow with or without nitrogen
- Low void
- Over 8 hours stencil life
- Extended tack time > 12 hours
Solder Wire
High purity alloy that is composed of 60% Tin and 40% Lead from virgin metals.
Applies at hand or feed soldering processes in Electronics & Electrical assemblies.
Non-corrosive and no impact of flux residues forming at post soldering which means of
passing in pin probe & flying probe tests for No Clean solder wires.
If required, flux residues shall be cleaned with appropriate liquid application.
Précised amount of flux cored from state-of the-art-technology manufacturing process.
Dross Reducer
Solder Thinner
